top of page


November 29, 2022

SemIsrael Expo 2022 is packed with professional content; great keynote speakers, and 4 professional tracks:

  • IP & Cores

  • Front-end Design & Verification

  • Physical Design

  • Post Silicon

Professional tracks presentations will start after a general assembly session.


Event agenda - General

08:00 - 09:15

Breakfast, Exhibit Viewing

10:30 - 11:20

Break, Exhibition Visit

11:20 - 13:00

13:00 - 14:00

Lunch, Exhibit Viewing

14:00 - 15:40

Professional Tracks - Part 2 (IP & Cores, Post Silicon)


Summary, Lucky Draws

Keynote Speakers (General Assembly)
(click here for detailed general assembly agenda)


09:15 - 09:30

Welcome Notes

Shuka Zernovizky

Founder, SemIsrael

09:30 - 09:50

Digitalization Verification and Validation – Challenges and Directions

Jean Marie Brunet

VP and GM , HW Assisted Verification, Siemens EDA

09:50 - 10:10

Driving the Photonic IC (R)evolution

Yuval Shay

Director of Product Management & Marketing, Synopsys

10:10 - 10:30

The Impact of AI in Intelligent System Design

Matt Graham
Product Engineering Group Director, System and Verification Group, Cadence

IP & Cores Track
(click here for detailed track agenda)
Shin (Shimon) Raviv, Director Product Marketing, Weebit Nano
​Ilan Sever, VP R&D, Weebit Nano


11:20 - 11:40

Expanding DFT Automation for 2.5D / 3D IC

Itamar Tsachi

Technical Account Manager, IC Verification & Validation, Siemens EDA

11:40 - 12:00

A Trusted Partner to Watch Your Back and Pave Your Path to Success

Costas Conistis

Sr. Director Sales, Alphawave IP

12:00 - 12:20

Enabling Software Developers with Software Acceleration with Reconfigurable Hardware Functions
Andy Jaros

VP Sales and Solutions Architecture, Flex Logix Technologies

12:20 - 12:40

SiFive Automotive, Transforming Safety-critical Applications With RISC-V Processors

Vadim Malenboim

Field Application Engineer, SiFive

12:40 - 13:00

Ultra-low Read Energy OTP

Wim van Seters

Sales Director Europe & Israel, Attopsemi Technology

13:00 - 14:00

Lunch, Exhibit Viewing

14:00 - 14:20

A Scalable Framework for Fast Design Space Exploration of AI Workloads in [Complex] SoCs

Paul Martin

Head of Solution Architectures, Sondrel

14:20 - 14:40

Actionable Insights Through Silicon Lifecycle Monitoring and Analytics
Avi Braun
Business Development Manager, Hardware Analytics & Test for Europe, Synopsys

14:40 - 15:00

Agile Analog’s Approach to IP Design, Quality - Why “Silicon Proven” is Not What You Think

Paul Gibson

Co-Founder and Strategy Consultant, Agile Analog

15:00 - 15:20

Softening Hardware: Using Application-Specific Processors to Optimize Modern SoC Designs
Patrick Verbist

Product Marketing Manager, ASIP Tools, Synopsys

15:20 - 15:40

Multi-Die Systems – Challenges and Solutions

Michael Chen

Sr. Manager,  Applications Engineering DesignWare IPs, Synopsys

Front-end Design & Verification Track
(click here for detailed track agenda)

Sponsored by:
Moderator: Alex Marin, RnD Team Leader, AMIQ EDA


11:20 - 11:40

Functional Static Sign-Off’s Expanding Role

Oren Katzir

VP, Application Engineering & Business Development, Real Intent

11:40 - 12:00

Enhance Verification Using Scalable FPGA Prototyping Solution

David Kaushinsky

Senior Application Engineer,  Siemens EDA

12:00 - 12:20

Hardware Design and Verification IDE built on VS Code or Eclipse: Your Choice

Alex Marin

RnD Team Leader, AMIQ EDA

12:20 - 12:40

Artificial Intelligence Verification-The Future of Chip Verification

Nitin Kishore

CEO, Truechip Solutions

12:40 - 13:00

The Key Success Factors to Make Your ASIC Project a Game Changer

Jannik Nielsen
VP R&D, Presto Engineering

13:00 - 14:00

Lunch, Exhibit Viewing

physical design

Physical Design Track
(click here for detailed track agenda)
Sponsored by:

Moderator: Nahum Rozen, Aprisa P&R Application Engineering Specialist, Siemens EDA

Siemens logo

11:20 - 11:40

Multi-die System Design and 3D, The Next Big Step in IC Evolution
Leon Rabinovich
Senior AE, Synopsys

11:40 - 12:00

Under the Hood of OpenFPGA

Pierre-Emmanuel Gaillardon
CTO, Rapid Silicon

12:00 - 12:20

New Layout Methodologies and ​Advanced Node Automation
Yonatan Kliger
Application Engineer Director, Cadence

12:20 - 12:40

Intrinsic Intelligent P&R For Advanced Node Designs

Nahum Rozen

Aprisa P&R Application Engineering Specialist, Siemens EDA

12:40 - 13:00

Power (Source) Aware Floor Planning
Jorge Antonio Araiza Martinez
Technical Layout Lead, ICMASK

13:00 - 14:00

Lunch, Exhibit Viewing

Post Silicon Track
(click here for detailed track agenda)
Sponsored by:

Moderator: Ronen Livni, ATE Test and Product Manager, Vayyar

post silicon
amkor logo

14:00 - 14:20

Why Advanced Packaging & 3D Integration Does Matter to Everybody

Anna Fontanelli

Founder & CEO, Monozukuri

14:20 - 14:40

30 Thousand Wafers in Your Browser
John O'Donnell
Founder and CEO, yieldHUB

14:40 - 15:00

3D IC Test Challenges and Solutions

Martin Dresler

Director Performance Digital Business, Advantest

15:00 - 15:40

Advanced Packaging & Challenges for Test

George Harris

Vice President, Global Test Services, Amkor Technology

bottom of page