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Agenda

December 13, 2021

MDI Expo 2021 is packed with professional content; great keynote speakers, and 4 professional tracks:
 

  • IP & Cores

  • Front-end Design & Verification

  • Physical Design

  • Post Silicon

Professional tracks presentations will start after a general assembly session.

 

Event agenda - General

08:00 - 09:20

Breakfast, Exhibit Viewing

09:20 - 10:40

General Assembly - Keynote Speakers

10:40 - 11:20

Break, Exhibition Visit

11:20 - 13:00

Professional Tracks - Part 1 (IP & Cores, Front-end Design & Verification, Physical Design)

13:00 - 14:00

Lunch, Exhibit Viewing

14:00 - 15:40

Professional Tracks - Part 2 (IP & Cores, Post Silicon)

15:40

Summary, Lucky Draws

Keynote Speakers (General Assembly)
(click here for detailed track agenda - soon)

 

09:20 - 09:40

Welcome Notes

Shuka Zernovizky

Founder, SemIsrael

09:40 - 10:00

Digitalization - Fueling the Semiconductor Market Resurgence

Joseph Sawicki

Executive Vice President, Siemens EDA

10:00 - 10:20

A New Infrastructure for a New Era

Eddie Ramirez

VP of Marketing, Infrastructure Business Unit, Arm

10:20 - 10:40

New Semiconductor Ecosystem – Innovations Welcome!

Steve McDonald

Regional Vice President, Europe, Synopsys

IP & Cores Track
(click here for detailed track agenda - soon)

 

11:20 - 11:40

ATPG Boost: Improve Test Quality in Less Time

Itamar Tsachi

Technical Account Manager, IC Verification & Validation, Siemens EDA

11:40 - 12:00

A Trusted Partner to Watch Your Back and Pave Your Path to Success

Mauro Diamant

SiFive and OpenFive Sales Representative in Israel

12:00 - 12:20

TBD by Flex Logix

12:20 - 12:40

RISC-V Going to Vectors and Out-of-order

Vadim Malenboim

Field Application Engineer, SiFive

12:40 - 13:00

Selecting the Right High Bandwidth Memory

Frank Ferro

Sr Dir Product Marketing, Rambus

13:00 - 14:00

Lunch, Exhibit Viewing

14:00 - 14:20

Ultra-low Read Energy (0.4V/1uA) OTP for IoT Applications

Wim van Seters

Sales Director Europe & Israel, Attopsemi Technology

14:20 - 14:40

Trends and Challenges in Building Automotive SoCs
Arm

14:40 - 15:00

Design Beyond Standards, IPaaS (IP-as-a-Service)

Gary Golembo

Director of Business Development, HCL Technologies, Engineering R&D Services (ERS)

15:00 - 15:20

A Leap Forward in Memory Technology for a New Era of Intelligent Devices

Amir Regev

VP Technology Development, Weebit Nano

Front-end Design & Verification Track
(click here for detailed track agenda - soon)

 

11:20 - 11:40

Functional Static Sign-Off’s Expanding Role

Vishnu Vimjam, Ph.D.

Chief Architect, Real Intent

11:40 - 12:00

Enhance Verification Using Scalable FPGA Prototyping Solution

David Kaushinsky

Senior Application Engineer,  Siemens EDA

12:00 - 12:20

Why Wait For Simulation? Catch Functional Bugs Much Earlier!

Yaron Ilani

Director, Applications Engineering, Synopsys

12:20 - 12:40

TBD

12:40 - 13:00

TBD

13:00 - 14:00

Lunch, Exhibit Viewing

 

Physical Design Track
(click here for detailed track agenda - soon)

11:20 - 11:40

Innovative Test Solutions For Advanced Silicon Nodes

Tal Kogan

European DFT Manager, Synopsys

11:40 - 12:00

TBD

12:00 - 12:20

An Efficient Design Flow For IC Power Module Design

Nikola Kontic

Solution Architect, Zuken

12:20 - 12:40

Innovative Chips and Cooler Designs with Aprisa

Nahum Rozen

Aprisa P&R Application Engineering Specialist, Siemens EDA

12:40 - 13:00

TBD

13:00 - 14:00

Lunch, Exhibit Viewing

Post Silicon Track
(click here for detailed track agenda - soon)

 

14:00 - 14:20

TBD by ATS Engineering

14:20 - 14:40

TBD

14:40 - 15:00

Heterogeneous IC Packaging for Advanced AI Applications

Fernando Roa

Sr Director, fcCSP/fpfcCSP/PoP, Amkor Technology

15:00 - 15:20

Advanced Packaging Technologies to Enable New Applications

Fernando Roa

Sr Director, fcCSP/fpfcCSP/PoP, Amkor Technology