Post Silicon Track
Moderator: Daniel Lipovitch, Director of Marketing, Weebit Nano
Meir Gellis
CEO
TestInsight
11:40 - 12:00
Get Ready for Production Test Before Silicon With an ATE Digital Twin
This presentation address the challenge of late silicon delivery due to production test issues.
In most cases, production test program and test hardware debug starts only after first silicon is available.
This phenomena may lead to late identification of test related issues and late delivery of first silicon samples to customers.
The presentation offers an approach using a "digital twin" of the ATE and the test hardware to verify the test infrastructure before silicon is available and thus prevent such last minute debug issues, enabling a more robust schedule and avoid delivery delays due to test related issues.
BIO:
Meir Gellis is Testinsight CEO focusing on design to test solutions.
Testinsight is the selected OEM partner of both Advantest and Teradyne, leading the design to test software solutions market for over 20 years with hundreds of users from all segments of the industry Fables, Fab, and service providers.
Meir holds BSC and MBA from Tel Aviv university
12:00 - 12:20
Solving the Cooling Challenges from Chip to Data Center Level by Numerical Simulation
As computing power continues to grow—driven primarily by the increasing demands of artificial intelligence—cooling has become a critical challenge at every level of electronic systems, from individual chips to entire data centres. At the chip level, rising power densities require advanced thermal management techniques, precise thermal design at the board and TIM levels, and optimized heat exchangers. At the server and rack levels, efficient heat removal depends on the coordinated design of airflow, liquid cooling loops, and component layout. At the data center scale, energy efficiency and sustainability rely on system-level strategies such as hot and cold aisle containment and advanced liquid cooling architectures. Addressing these multiscale thermal challenges is essential to improve reliability, reduce energy consumption, and enable future high-performance computing infrastructures. This presentation demonstrates how thermal and CFD simulations contribute to optimizing these cooling design processes and achieving better overall system performance.
BIO:
PhD and Ms.c. (Technion institute of technology, Haifa, Israel), in the field of thermal and dynamic analysis optimization. Mr. Levy specializes in mechanical dynamical and thermal consulting and simulation, with over 30 years of experience. CAS team made large number of projects over those years.
Dr. Eldad Levy
CEO
CAS - Computerized Analysis & Simulations Ltd.
Yenon Ben-Haim
Application Tech Lead
NOVA
12:20 - 12:40
Advanced Metrology Solutions for AI Packaging Processes
High-performance advanced packaging—anchored in 2.5D and 3D integration schemes and HBM—has become a key enabler of the AI chips' evolution path. These architectures’ growing process complexity makes high-yield manufacturing and long-term reliability increasingly challenging. The presentation will highlight major challenges, solutions, and associated technologies . We will showcase innovative solutions tailored to the most demanding 3DIC and hybrid bonding applications. These solutions offer proven advantages in the inline characterization of critical process elements, including TSVs, Cu Pads, RDLs, and pre-bonding wafer-edge topography.
BIO:
Yenon holds M.Sc degree in physics from Ben Gurion University and a bachelor’s degree (B.Sc) in material engineering and physics from Ben Gurion University.
Yenon started working in Nova 6 years ago, in the application group – and became an application tech lead at Nova HQ Israel.
During this time Yenon became an expert on Nova OCD tools (both standalone and Integrated metrology tools) – Developed many applications for advanced packaging, Logic and Memory technologies using Nova most advanced OCD tools and state-of-the-art algorithms.
Dikla Levi
CEO
DLVS Consultancy
12:40 - 13:00
Future-Proof Your Lab: Strategies & Solutions for Modern R&D Spaces
Unlock the secrets to designing laboratories that are ready for the demands of tomorrow. In this practical and insightful session, you’ll discover:
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Actionable strategies to achieve flexible, resilient, and sustainable laboratory environments
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Powerful solutions like advanced cooling, intelligent control systems, and modular layouts, all tailored to accelerate R&D and boost operational efficiency
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Real-life lessons from a recent high-impact laboratory transformation (industry case study), what worked, challenges faced, and proven results
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Practical tools and ideas to enhance safety, collaboration, and adaptability in your own facilities
Step beyond theory: leave with concrete methods and inspiration to lead your next lab project with confidence and innovation.
BIO:
Dikla Levi is an expert in designing labs, data centers and technical spaces for organizations driving positive change. Her work blends innovative thinking with a deep understanding of clients’ needs, delivering custom solutions that are both highly functional and aesthetically refined. From data centers and cleanrooms to labs and manufacturing lines, Dikla tailors each project for flexibility, efficiency, and future growth. She has planned facilities for global leaders—like Amazon, NVIDIA, Motorola, and Edwards.